Using high resolution full die image data for inspection

使用高分辨率全裸片图像数据进行检验

Abstract

本发明提供用于相对于所存储高分辨率裸片图像确定检验数据的位置的方法及系统。一种方法包含:使由检验系统针对晶片上的对准位点获取的数据与关于预定对准位点的数据对准。所述预定对准位点在所述晶片的所存储高分辨率裸片图像的裸片图像空间中具有预定位置。所述方法还包含:基于所述预定对准位点在所述裸片图像空间中的所述预定位置而确定所述对准位点在所述裸片图像空间中的位置。另外,所述方法包含:基于所述对准位点在所述裸片图像空间中的所述位置而确定由所述检验系统针对所述晶片获取的检验数据在所述裸片图像空间中的位置。
Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.

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Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    CN-101197301-AJune 11, 2008奥林巴斯株式会社Defect testing device and method
    US-2007133860-A1June 14, 2007Lin Jason Z, Xing Chu, Kenong Wu, Mccauley SharonMethods and systems for binning defects detected on a specimen
    US-2009078868-A1March 26, 2009De Jonge NielsMethod and apparatus for a high-resolution three dimensional confocal scanning transmission electron microscope
    US-2011286656-A1November 24, 2011Kla-Tencor Technologies CorporationMethods and systems for utilizing design data in combination with inspection data

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